Laser Marking on 6 inch arrays with over 2000 sections of ~1mm x ~1mm semiconductor. Each marking containing two lines of text, and the ability to include a logo. It was required to mark on 2 different surfaces, epoxy and gold plated.
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Gold Plated Wafer - 200 μm Text | Gold Plated Wafer - 300 μm Text | Gold Plated Wafer - 400 μm Text |
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Epoxy Wafer - 200 μm Text | Epoxy Wafer - 300 μm Text | Epoxy Wafer - 400 μm Text |